Which benefit is provided by having identical Interconnect modules in adjacent bays of the c7000
enclosure?

A.
reduced power requirements

B.
dynamic IO bandwidth

C.
improved uplink failure detection

D.
redundant IO capabilities

Explanation:
http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00816246/c00816246.pd
f(page 15, third paragraph on the page)